EPF-ESTP Summer Program on Smart Cities & Engineering for Sustainable Architecture offers an in-depth study on topics such as engineering for eco-cities and smart cities, environmental issues, city planning and architecture for the future. Mainly designed for Undergraduate and Master students with a major in Engineering, Architecture, Urban planning/design, Sociology or Computer Sciences.
The program is organized in 4 independent modules in the two cities of Troyes and Paris. Students may participate in one, several or all 4 modules:
Within this 4-module program a particular attention is dedicated to the following subjects:
- Smart cities
- Building Information Modelling (BIM)
- Urban comfort
- Interior comfort
- Energy efficiency
- Digital transition
- Energy transition
Each module is composed of several workshops and a real case study. Upon success, by the end of each module, students may obtain a
certificate and 2 Credits (ECTS).
CULTURAL VISITS AND FIELD TRIPS
Besides the academic lectures and projects, EPF & ESTP Engineering Summer School organizes a cultural program, which will allow students to discover 2 of the most beautiful areas of France: Paris & the Champagne region. Cultural visits may include:
- Project site visits
- Architectural sightseeing
- Historical sightseeing
- Bateaux mouches cruise on the Seine River, Paris
- Tastings in the Champagne-Ardenne Region
All students will be initiated to the French language in addition to cultural visits, which will contribute to a perfect understanding of the local social and professional environment.
Note: Program content may be subject to change or cancellation based upon low enrollment
APPLICATION AND FEES
The program fee of 950 € a week covers:
- Tuition and documentation
- Welcome and farewell events
- Access to EPF and ESTP Paris facilities
- Free internet access
- Official programme certificate
- Cultural and social events
- Lodging expenses
For students attending the 4 modules a special fee of 3.500 € will apply.
Living expenses, individual insurances and visa fees are not included.
APPLICATION DEADLINE - APRIL 15, 2019